Nombre del producto:4,4'-(1-(4-(2-(4-Hydroxyphenyl)propan-2-yl)phenyl)ethane-1,1-diyl)diphenol

IUPAC Name:4-(2-{4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl}propan-2-yl)phenol

CAS:110726-28-8
Fórmula molecular:C29H28O3
Pureza:95%
Número de catálogo:CM247724
Peso molecular:424.54

Unidad de embalaje Stock disponible Precio($) Cantidad
CM247724-25g in stock ȎŢ
CM247724-100g in stock ǵĽź

Sólo para uso en I+D..

Formulario de consulta

   refresh    

Detalles del producto

Núm. De CAS :110726-28-8
Fórmula molecular:C29H28O3
Punto de fusión:-
Código de sonrisas:CC(C)(C1=CC=C(O)C=C1)C1=CC=C(C=C1)C(C)(C1=CC=C(O)C=C1)C1=CC=C(O)C=C1
Densidad:
Número de catálogo:CM247724
Peso molecular:424.54
Punto de ebullición:623.1°C at 760 mmHg
Nº Mdl:MFCD00191685
Almacenamiento:Store at room temperature.

Category Infos

Photoresist
Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.